ECSI designs, builds and supplies efficient, precision bench-top wet processing equipment that liberate researchers and manufacturers from the relative haphazardness of conventional systems.
ECSI (Electrochemical Systems, Inc.) makes tools that work. We design, build and supply efficient, precision bench-top wet processing equipment for electroplating, electroforming, electrocleaning and etching of metal microelectromichanical systems (MEMS) and high density interconnects (HDI) in academic, R&D and manufacturing applications. FIBRotools™ are ideally suited for optimized electroplating of wafers and wafer sections in semiconductor, MEMS, NANO and advanced high density interconnects and electronics packaging fabrication.
Our objective is to make wet processing practical. Our tools liberate researchers and manufacturers from the relative haphazardness of conventional systems. MEMS, Wafers and High Density Interconnects electroplating and electroforming with our equipment is predictable, easy and affordable.